晶圆贴膜机 Wafer Mounter
时间:2023-04-24浏览量:352
产 品 说 明 晶圆贴膜机 (Wafer Mounter)性能及特点:切割制程用 For dicing processes 迅速的将晶圆贴在有胶膜的框架上,适合所有的切割框架,有效的切割及减少对框架伤害的特殊设计For rapid mounting of dicing frames, wafers and film. Suitable for all types ofdicing frames ,specially-desig…